Epotec® YDCW 6033 : Epotec® TH 8286 / Epotec® TH 82867
Epotec® YDCW 6033 : Epotec® TH 8286 / Epotec® TH 82867
AMBIENT TEMPERATURE CURING EPOXY SYSTEM
部件
  • Epotec® YDCW 6033-Modified Liquid Epoxy Resin
  • Epotec® TH 8286-Fast - reactive modified polyamine hardener
  • Epotec® TH 8287-Slow - reactive modified polyamine hardener
特点及优势
  • Hardeners can be used alone or blended to obtain maximum reactivity
  • Fillers up to 80-90% by weight can be added for Casting
  • Low processing mix viscosity
  • Marten’s Heat Distortion Temperature > 120°C
  • Improves impregnation of reinforcement
  • Optimal mechanical & electrical properties
应用
 Electrical Casting- LV Bus Bar
Electrical Casting- LV Bus Bar
 Potting- electronic component
Potting- electronic component
 Encapsulation- electronic component
Encapsulation- electronic component
属性
TDS
MSDS
法规
可用性和样品
Epotec® Resin YDC 6033
FeatureValueUnitTest Method
Epotec® Hardener TH 8286
FeatureValueUnitTest Method
Epotec® Hardener TH 8287
FeatureValueUnitTest Method
Processing properties TH 8286
FeatureValueUnitTest Method
Processing properties TH 8287
FeatureValueUnitTest Method