Electrical components need protection from mechanical shocks, humidity, moisture and corrosion. This is essential to ensure their consistent performance and seamless uptime. Epoxy Resin Systems for Potting & Encapsulation deliver outstanding properties for insulation, thermal stability, adhesion and chemical resistance, ensuring long-term performance.

Potting-It is a widely used casting method for insulation of wide variety of electronic components and includes a pot or case or shell with device. The insulating resin system is filled to the top of the case covering and completely encasing the device. The method is used for high-speed production and helps in realizing light weight components and avoiding breakdowns, prevent failures due to moisture and vibration in components.

Encapsulation-It is a method of providing a protective coating on the inside of coils, closed-packed electronic assemblies or wire bundles by dipping it into an insulating resin system resulting in a thick coating completely surrounding the unit.

Epotec offers resin systems for potting & encapsulation from low to high voltage applications with high flow and wetting properties, outstanding electrical insulation and thermal stability, good adhesion and superior moisture & chemical resistance. This ensures long-term performance of the components. The products include fire retardant, UL 94 V0 and RoHS compliant systems. Room temperature curing Epotec® Systems are preferred for low voltage, small components, while heat-cured Epotec® Systems offer extremely high physical, thermal and chemical resistance.