CeTePox® AM XP 189 A : CeTePox® AM 5597 : CeTePox® AM XP 332 C
SOLVENT-FREE LOW TACK HOT-MELT PREPREG EPOXY SYSTEM
Components
- CeTePox® AM XP 189 A-Medium viscous hot melt Epoxy Resin
- CeTePox® AM 5597-Paste of Dicyandiamide in liquid Epoxy Resin
- CeTePox® AM XP 332C-Paste of an accelerator in liquid Epoxy Resin
Features & Benefits
- Cured at elevated temperatures- 100-130°C
- Good drapability
- Controlled tack & flowability
- Good shelf-life at room temperature
- High thermal & mechanical properties
- High fatigue resistance
- Optimized fibre-matrix adhesion
- Outstanding peel and inter-laminar shear strength
- Withstands thermal & hot wet stress
Applications
High-performance structural parts
Industrial
Properties
TDS
MSDS
Regulatory
Availability & Samples
CeTePox® AM XP 189 A
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CeTePox® AM 5597
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CeTePox® AM XP 332 C
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System Properties
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